Laser processing of ceramics is typically performed using a 10 6 or 9 3 micron co 2 laser with some ceramics also absorbing a.
Fiber laser ceramics.
These properties include one of the.
Since the diameter of the standard optical fiber is 125 μm the depth of the microchannel is designed as 250 μm to ensure that the al 2 o 3 slurry filled on top of the embedded optical fiber can be sintered by the co 2 laser and the embedded fiber can survive the laser sintering process.
Laser power at least 40 watts of co 2 laser power is recommended for glass and ceramic laser engraving and for glass marking as well as marking certain ceramic materials like zirconia.
The 1 06 micron wavelength of the fiber laser is recommended for laser marking certain ceramic materials like aluminum silicate.
Detailed intricate patterns are also possible.
Examples of common ceramics include alumina al2o3 porcelain al2si2o5 oh zirconia zro2 earthenware silicon carbide sic and ceramic tile.
The laser s focused localized energy achieves very narrow cuts with small kerf widths.
However due to the cone shape of the focused ps laser.
Ceramic cutting from spi lasers aluminium nitride aln has been developed into a commercially viable product with many useful mechanical properties.